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Capability

stud bumping

Suppliers
1
States & provinces
1
Countries
1

1 stud bumping supplier across 1 states and provinces in 1 country. Profiles show capabilities, materials, certifications, and facility locations so you can compare shops and build a shortlist.

Suppliers

FIRST LEVEL INC.

YORK, PA

first level inc. is a technology-based contract assembly facility in York, Pennsylvania, specializing in first level microelectronics packaging. Since 2000 it has produced and assembled products for industries including medical electronics, optoelectronics, automotive sensors, military and aerospace, microwave and RF, and hybrid and multi-chip modules. It operates Class 10,000 ESD-protected cleanrooms and provides design, process, and manufacturing services from prototype to production.

BGA dicingdesign validationdie attachencapsulationfailure analysisflip chiphermetic lid sealingribbon bondingtestingtooling design and fabricationunderfillwire bonding

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