wire bonding

Advafab is an innovative semiconductor solutions provider delivering customer-specific products and services for demanding industries and applications. It offers semiconductor pixel sensor modules and diodes and 1D sensors, along with a comprehensive suite of semiconductor services from design to production, serving industry and academy.

clean room processingdicingelectrical measurementflip chip bondingmask designsensor manufacturingthin film processingunder-bump metallizationwafer solder bumpingX-ray probing

American Probe & Technologies, Inc. is a manufacturer of analytical probes and accessories for the semiconductor test and measurement industry, providing standard and custom solutions for OEM and end-users for over 30 years. The company has been manufacturing probes since 1984 and is located in Merced, CA. Its products serve probing, wire bonding, failure analysis, product engineering and production departments.

custom probe manufacturingengineering supportfailure analysistest and measurement

Amethyst Research Inc. is a small high-tech business, formed in 2004, that designs, develops, and delivers next-generation infrared detectors and emitters for government and commercial markets. It offers fully customized infrared solutions from epitaxial structure design through device prototyping and small-volume manufacturing, with a materials growth and device prototyping platform.

contact formationdevice testingdicingdopingetchinghydrogen passivationlithographymaterials characterizationmicrofabricationMolecular Beam Epitaxy (MBE)prototype packagingthermal bonding

AmTECH Microelectronics is a custom microelectronics assembly and packaging services company based in Silicon Valley (Morgan Hill, CA), with over 30 years of experience in process development, design for manufacturing (DFM), and on-shore prototype to production. Its facility features a fully equipped cleanroom with automated equipment, and it is ISO 9001:2015 and ISO 13485:2016 certified, ITAR registered, IPC-A-610 compliant, and follows MIL-STD-883 workmanship standards.

3D AOIDFMdie bonding/die attachencapsulationflip chip bondingmetrology and inspectionprocess developmentsilver sinteringSMT assemblyvacuum reflow

Pro-Active Engineering is an engineering-led electronics manufacturing services (EMS) provider building high-reliability PCB assemblies, box builds and full lifecycle program support for aerospace, defense, medical, industrial and critical power programs. Its Burnsville, MN facility operates as Analog Technologies, a Pro-Active Engineering company, providing advanced packaging, box build and full test capability since 1993.

AOIbox buildcable and harness assemblychassis and enclosure assemblydie attachfirmware loadingflip-chip assemblyflying probe testingfunctional testingPCB assemblyPCB designsilver sinteringSMT assemblythrough-hole assemblyX-ray inspection

Bascom Hunter delivers industry-leading power and control solutions and defense electronics catered to the aerospace and defense markets. The company maintains a strong commitment to quality, with design and manufacturing operations certified to AS9100D and ISO 9001:2015 at the Baton Rouge, O'Fallon, and Glendale sites. Bascom Hunter is also ITAR Registered.

AI/ML developmentEnvironmental testingFPGA/SoC firmware developmentmachine learning algorithm developmentmulti-chip module integrationoptical couplingpackagingPCB assembly manufacturingphotonic and MMIC/MCM packagingproductionrapid prototypingRF, microwave, photonic, and mixed-signal testingRF testingSMT and BGA assemblysubsystem qualification

Bryka Inc is an ITAR-compliant, woman-owned small business that has been designing, developing, integrating, and assembling semiconductors for space operations since 1980. It specializes in Mixed-Signal and Radiation-Hardened ASICs and System-on-a-Chip solutions for space applications, serving semiconductor, defense, and aerospace clients.

Boule Formationburn-in testingcircuit designcuringdecapsulationDie Attachmentengineering & designfunctional analysisIntegrated Circuit DesignLead FormationPackage AssemblyqualificationReliabilityreverse engineeringscanning electron microscopySystem-On-Chip Designwafer fabricationWafer Testing

Chip Design Systems (CDS) is a leader in dynamic infrared scene projector (IRSP) systems for hardware-in-the-loop (HWIL) sensor testing, powered by advanced IRLED technology. Founded in 2013, CDS develops advanced LED Infrared Scene Projectors for testing Focal Plane Arrays (FPAs), enabling simulation of real-world infrared environments for applications such as hypersonic testing, missile defense, sensor calibration, and signature modeling.

ASIC designcryogenic packagingcustom system developmentfirmware developmentHWIL simulationinfrared scene generationNon-Uniformity Correction (NUC)sensor testingsoftware development

Chi 3 Optics combines lean manufacturing practices with advanced optical techniques to create ultra low phase noise high power lasers. The company offers services ranging from CAD design to optical layout, and provides micro-optics packaging and design, high power and broadband laser sources, and precision machining.

CAD designdie bondingfiber shapingfiber splicingglass processingmicro-optics packagingoptical layoutprecision machining

Dallas Quantum Devices is a self-funded boutique photonics company founded in October 2018 by Jim Tatum, Luke Graham, and Pritha Khurana. It focuses on providing unique laser and detector solutions, specializing in highly customized VCSEL and photodiode solutions, and has developed VCSEL epitaxial structures ranging from 650nm to more than 1000nm fabricated into single mode, high power, and high speed devices.

automated optical inspectiondie attachflip chip mountingnear and far field measurementsphotonic design softwaresmall signal analysis to 40GHzthermo-compression bondingVCSEL designwafer level testingwafer qualification testing

Druck is a global leader in precision pressure technology, designing, developing and manufacturing pressure sensors, calibrators, controllers and test instruments for critical industries including aerospace, energy, industrial, healthcare, electronics, metrology and transportation. As a Crane Company brand with over five decades of pressure expertise, Druck owns the full value chain from silicon design to calibration, including its proprietary TERPS resonant silicon pressure sensor technology.

calibrationelectron-beam weldingOEM custom sensorspressure sensor design and manufacturingrepair servicessilicon wafer and die fabrication

FEI-Elcom Tech, Inc. was founded in 1995 as a design and manufacturing company specializing in DRO-based RF frequency sources. Today it builds high-performance ultra-wideband Electronic Warfare solutions including synthesizers, up/down converters, RF front ends, receivers, and phase locked oscillators for airborne, seaborne, and rugged terrestrial environments. Customers include the US DoD and prime contractors such as BAE, Northrop Grumman, Lockheed Martin, Boeing, Raytheon, and NAVAIR.

100% burn indigital designEmbedded SoftwareFPGA designHALT/HASS testinghermetically sealed packagingHybrid Thin and Thick Film technologiesLabView ATE testing up to 40 GHzmechanical designMICMMICPCB designRF cable assemblyRF hardware designRF & MW module assemblyschematic layoutsystems software

first level inc. is a technology-based contract assembly facility in York, Pennsylvania, specializing in first level microelectronics packaging. Since 2000 it has produced and assembled products for industries including medical electronics, optoelectronics, automotive sensors, military and aerospace, microwave and RF, and hybrid and multi-chip modules. It operates Class 10,000 ESD-protected cleanrooms and provides design, process, and manufacturing services from prototype to production.

BGA dicingdesign validationdie attachencapsulationfailure analysisflip chiphermetic lid sealingribbon bondingstud bumpingtestingtooling design and fabricationunderfill

Golden Altos Corporation (GAC) is a full-service provider of post-wafer fab operations serving the semiconductor, military, and aerospace industries. Founded in 1991 and headquartered in Fremont, California, it offers hermetic high-reliability assembly, qualification testing, burn-in services, and program management for single chip and hybrid/multichip module products.

burn-in servicesdie attachelectrical testinghermetic assemblyhybrid assemblylead finishmarkingmechanical and environmental testingmultichip module assemblyprogram managementqualification testingsealing and encapsulationwafer backgrindingwafer inspectionwafer platingwafer saw

Kooker Technologies (KT) is a privately owned small business that designs and manufactures custom hybrid microcircuits. It also provides microelectronic services ranging from dynamic piezo sensor or crystal design to rad hard ASICs, often using creative assembly and process techniques. KT is registered with the Supplier Award Management Systems and holds DUNS number 194217944 and CAGE code 7JYY3.

assembly/process techniquesdie attachhybrid microelectronic designinspection IAW Mil-Std-883 and Mil-PRF-38534manufacture