Skip to content
777 Sourcing.

Capability

flip chip

Suppliers
2
States & provinces
2
Countries
1

2 flip chip suppliers across 2 states and provinces in 1 country. Profiles show capabilities, materials, certifications, and facility locations so you can compare shops and build a shortlist.

Suppliers

AMKOR TECHNOLOGY ARIZONA, INC

TEMPE, AZ

Amkor Technology, Inc., headquartered in Tempe, Arizona, is a global leader in the Outsourced Semiconductor Assembly and Test (OSAT) industry. The company provides semiconductor packaging and test services, with more than 30,000 employees at 20 manufacturing locations in 11 countries. Amkor started its first semiconductor business in Korea in 1968 and was listed on NASDAQ (AMKR) in 1998.

2.5D/3D TSVburn-in testingsemiconductor packagingsemiconductor testSystem-in-Package (SiP)system level testwafer bumpingwafer level packaging

Compiled from public sources

FIRST LEVEL INC.

YORK, PA

first level inc. is a technology-based contract assembly facility in York, Pennsylvania, specializing in first level microelectronics packaging. Since 2000 it has produced and assembled products for industries including medical electronics, optoelectronics, automotive sensors, military and aerospace, microwave and RF, and hybrid and multi-chip modules. It operates Class 10,000 ESD-protected cleanrooms and provides design, process, and manufacturing services from prototype to production.

BGA dicingdesign validationdie attachencapsulationfailure analysishermetic lid sealingribbon bondingstud bumpingtestingtooling design and fabricationunderfillwire bonding

Compiled from public sources

Related capabilities

Other processes offered by the shops that list flip chip.

Browse all capabilities