warping analysis

Suppliers: 1
States & provinces: 1
Countries: 1

1 warping analysis supplier across 1 states and provinces in 1 country. Profiles show capabilities, materials, certifications, and facility locations so you can compare shops and build a shortlist.

Suppliers

DGClaim Inc is a thermal analysis/management tech company based in Portland, Oregon. The team has years of experience in semiconductor manufacturing, especially thermal/stress analysis within packages and data centers. DGClaim provides thermomechanical analysis and datacenter design/automation tools to root-cause analyze and resolve cracking, delamination, and warpage problems in semiconductor package assembly, 3D printing, and data centers.

3D printing analysisdatacenter design/automationfracture analysisnumerical methods analysisthermal simulationsthermomechanical analysis

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Other processes offered by the shops that list warping analysis.

3D printing analysis (1)
datacenter design/automation (1)
fracture analysis (1)
numerical methods analysis (1)
thermal simulations (1)
thermomechanical analysis (1)

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warping analysis

Suppliers

DGCLAIM INC

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