thermal simulations

C/A Design, Inc., a member of the Heico Companies, is a leading innovator in engineered rugged and embedded cooling solutions for the Aerospace and Defense sector. Headquartered in Exeter, NH, with additional operations in Raleigh, NC, the company leverages decades of expertise in mechanical and thermal design to manufacture mission-critical products, including vacuum and dip braze ments, rugged chassis, conduction cooled heat frames, wedgelock card retainers, liquid flow-through heat frames, and complex high-tolerance machined components.

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3, 4 and 5 axis machiningbraze designchromate conversion coatingCNC machiningDFM engineeringdip brazingheat treatmentin-house test labmulti-axis manufacturingthermal engineeringvacuum brazing

DGClaim Inc is a thermal analysis/management tech company based in Portland, Oregon. The team has years of experience in semiconductor manufacturing, especially thermal/stress analysis within packages and data centers. DGClaim provides thermomechanical analysis and datacenter design/automation tools to root-cause analyze and resolve cracking, delamination, and warpage problems in semiconductor package assembly, 3D printing, and data centers.

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3D printing analysisdatacenter design/automationfracture analysisnumerical methods analysisthermomechanical analysiswarping analysis