Capability

under-bump metallization

Suppliers: 1
Countries: 1

1 under-bump metallization supplier. Profiles show capabilities, materials, certifications, and facility locations so you can compare shops and build a shortlist.

Suppliers

Advafab is an innovative semiconductor solutions provider delivering customer-specific products and services for demanding industries and applications. It offers semiconductor pixel sensor modules and diodes and 1D sensors, along with a comprehensive suite of semiconductor services from design to production, serving industry and academy.

clean room processingdicingelectrical measurementflip chip bondingmask designsensor manufacturingthin film processingwafer solder bumpingwire bondingX-ray probing

Related capabilities

Other processes offered by the shops that list under-bump metallization.

clean room processing (1)
dicing (1)
electrical measurement (1)
flip chip bonding (1)
mask design (1)
sensor manufacturing (1)
thin film processing (1)
wafer solder bumping (1)
wire bonding (1)
X-ray probing (1)

Browse all capabilities

under-bump metallization

Suppliers

ADVAFAB OY

Related capabilities