Capability

flip chip BGA and CSP

Suppliers: 1
States & provinces: 1
Countries: 1

1 flip chip bga and csp supplier across 1 states and provinces in 1 country. Profiles show capabilities, materials, certifications, and facility locations so you can compare shops and build a shortlist.

Suppliers

Deca is a leading independent provider of advanced packaging technology to the semiconductor industry, offering M-Series fan-out technology and Adaptive Patterning. It provides technology enablement, consulting, and IC package design services, and has shipped over seven billion devices to leading smartphones worldwide.

2.5 & 3D chipletsembedded bridge die interposerfan-out panel level packaging (FOPLP)fan-out wafer level packaging (FOWLP)IC package designpackage on package (PoP)passive & active interposertechnology licensing

Related capabilities

Other processes offered by the shops that list flip chip BGA and CSP.

2.5 & 3D chiplets (1)
embedded bridge die interposer (1)
fan-out panel level packaging (FOPLP) (1)
fan-out wafer level packaging (FOWLP) (1)
IC package design (1)
package on package (PoP) (1)
passive & active interposer (1)
technology licensing (1)

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flip chip BGA and CSP

Suppliers

DECA TECHNOLOGIES USA INC.

Related capabilities