Skip to content
777 Sourcing.

Capability

fan-out wafer level packaging (FOWLP)

Suppliers
1
States & provinces
1
Countries
1

1 fan-out wafer level packaging (fowlp) supplier across 1 states and provinces in 1 country. Profiles show capabilities, materials, certifications, and facility locations so you can compare shops and build a shortlist.

Suppliers

DECA TECHNOLOGIES USA INC.

TEMPE, AZ

Deca is a leading independent provider of advanced packaging technology to the semiconductor industry, offering M-Series fan-out technology and Adaptive Patterning. It provides technology enablement, consulting, and IC package design services, and has shipped over seven billion devices to leading smartphones worldwide.

2.5 & 3D chipletsembedded bridge die interposerfan-out panel level packaging (FOPLP)flip chip BGA and CSPIC package designpackage on package (PoP)passive & active interposertechnology licensing

Compiled from public sources

Related capabilities

Other processes offered by the shops that list fan-out wafer level packaging (FOWLP).

Browse all capabilities