die bonding

Advanced International Technology LLC specializes in back-end wafer processing, dicing, micro-assembly, and fabrication services, with a focus on prototyping and small to medium builds. The company performs dicing for substrate materials and offers wire bonding approaches including wedge bonding, ball bonding, and die bonding for customized assembly of microelectronics. Its solutions serve applications in data storage, biotechnology, MEMS, and nanotechnology.

ball bondingdicingengineeringfabricationmicro-assemblyprecision machiningwafer processingwedge bonding

ASMPT is a global supplier of hardware, software and service solutions for semiconductor and electronics manufacturing. Founded in 1975, it offers integrated solutions covering all major steps in electronics manufacturing, from chip interconnection to chip assembly and packaging to SMT. It operates two main segments, Semiconductor (SEMI) Solutions and SMT Solutions, plus software subsidiary Critical Manufacturing.

advanced packagingchiplet integrationflip chip bondinglaser dicingline integration automationmanufacturing execution systemsmoldingsinteringSMT placementstencil printingthermo-compression bondingwire ball bonding

Chi 3 Optics combines lean manufacturing practices with advanced optical techniques to create ultra low phase noise high power lasers. The company offers services ranging from CAD design to optical layout, and provides micro-optics packaging and design, high power and broadband laser sources, and precision machining.

CAD designfiber shapingfiber splicingglass processingmicro-optics packagingoptical layoutprecision machiningwire bonding

ficonTEC provides device micro-assembly and testing solutions for the photonic device industry, realized as high-precision production systems using advanced automation. Its modular, scalable system architecture serves exploratory development through high-volume manufacturing. A globally installed base of over 2500 systems serves integrated photonics applications in telecom/datacom, 5G infrastructure, 3D sensing, automotive and aerospace, and high-power diode laser assembly.

die-level assemblyelectro-optical testingfiber-level assemblylaser chip stacking/unstackinglaser microweldingmachine visionoptical inspectionpassive and active alignmentphotonic device micro-assemblyprocess automationwafer-level assemblywafer-level electro-optical probing