ball bonding

Advanced International Technology LLC specializes in back-end wafer processing, dicing, micro-assembly, and fabrication services, with a focus on prototyping and small to medium builds. The company performs dicing for substrate materials and offers wire bonding approaches including wedge bonding, ball bonding, and die bonding for customized assembly of microelectronics. Its solutions serve applications in data storage, biotechnology, MEMS, and nanotechnology.

dicingdie bondingengineeringfabricationmicro-assemblyprecision machiningwafer processingwedge bonding

Azimuth Industrial Company Inc. was founded in 1972 and operates from a 20,000 sq ft manufacturing facility in Union City, California, serving U.S., Canadian and European customers. It specializes in plastic semiconductor packaging and ceramic packaging, assisting customers with new product evaluation, package design and development, and material selection and qualification. The company is ISO9001:2015 certified by TUV Rheinland Registrars and ITAR registered with the US Department of State.

compression moldingdie attachencapsulationflip chip bondingprototypingSMD placementsolder electro-platingtransfer moldingwafer sawing

Monzite designs and manufactures driver modules for GaN, GaAs and PIN Diode RF switches, linearizers, charge pumps and other products. The company assembles, tests and screens RF, Microwave and Millimeter-Wave assemblies and complex electronic circuit assemblies for aerospace, defense and medical applications, from prototype to production volumes.

automated productionchip-on-board assemblycustom packagingDesign for manufacturability (DFM)electrical testingenvironmental screeninggold and aluminum wire & ribbon bondingmixed SMT/chip & wireprototypingwedge bonding