thermocompression bonding

Applied Microengineering Ltd (AML) designs and manufactures wafer-bonding systems with integrated wafer-to-wafer alignment capabilities. The AWB and ROCK aligner-bonder systems enable a wide range of bonding techniques with in-situ optical alignment and can be configured to meet customer requirements. Systems are constructed at the Harwell Campus facilities with factory testing in a cleanroom. Founded in 1992, AML supplies systems worldwide in more than 25 countries.

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adhesive bondinganodic bondingdirect bondingeutectic bondingglass frit bondinghybrid bondingmetal layer bondingwafer bondingwafer-to-wafer alignment

Custom Electronics, Inc. (CEI), established in 1964, is a globally recognized manufacturer of high-voltage mica paper capacitors, specialty film capacitors, and tailored high-voltage electronic assemblies and sub-assemblies. Serving military, industrial, commercial, medical, defense, renewable energy, aerospace, and oil exploration markets, CEI is AS9100/ISO9001 certified and known for dependability, reliability, and high performance.

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abrasive blasting/tumblingacid etchingarc sprayingassemblycapacitor windingepoxy powder coatingfabricationmachiningpackagingPC board population and designplasma etchingplatingsubsonic flame sprayingtestingvacuum/pressure impregnation