packaging and testing

BIWIN Storage Technology Co., Ltd. produces high-quality flash storage and is known in embedded, consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware, and storage algorithms. It has complete packaging, testing, and production lines, and recently opened a 110,000 m² facility, Greater Bay Advanced Technology Co., Ltd., with R&D and production.

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16-Layer Die Stacking25 μm Wafer ProcessingCard PackageEnvironmental testingFailure Analysis (FA)firmware developmentFlip-Chip Ball Grid Array (FC-BGA)Flip Chip-Chip Scale Package (FCCSP)Land Grid Array (LGA)Multi-Chip & SiP PackagingReliability TestingStorage Algorithms DevelopmentSystem-in-Package (SiP)Wire Bonding Ball Grid Array (WB-BGA)

Digital Infrastructure Solutions (DIS) helps organizations implement technology-based business solutions to drive growth, support operational excellence, and increase innovation. With over 35 years of industry expertise, DIS works with customers from evaluation to deployment to create solutions tailored to their specific business goals, needs, and situations.

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automated deploymentcustom labelingdata backup and disaster recoverydeploymentfirmware updateshardware integrationHelp desk supportinfrastructure assessmentsinstallationinventory stagingIT infrastructure monitoringmigrationrunbook developmentsecurity and compliancesolution configurationssolution integrationstaffingtrainingzero-touch deployment