chip design

A-WIT Technologies, Inc. is an electronics design and development company founded in 2005 that provides a full set of product development services. Originally focused on embedded systems educational products, it pivoted in 2012 to product development services and opened a Product Development Center in the Princeton area in 2018. The company is led by Dr. Orlando J. Hernandez and is pursuing ISO 9000 certification.

algorithm developmentcircuit designCloud-based application development on AWS or Azureembedded systems developmentfirmware developmentFPGA development with Verilog or VHDLMobile app development for iOS and AndroidPCB design (rigid, flex, rigid-flex)Precision analog circuit designproduct developmentRF circuit designSchematic capture and layoutsoftware developmentSystem architecture

ChipFoundry, owned by UmbraLogic Technologies LLC, provides a platform for custom silicon chip design and manufacturing. It offers the chipIgnite platform for chip design, fabrication, and bring-up for product companies, startups, and university programs, using open-source tools and automated design flows. It also offers the chipDiscover kit for students and makers, and a Production Aggregation Anchor/Tenant model for 130nm volume production.

fabricationMPW shuttle fabricationQFN packagingRTL-to-GDSII open source design flowSoC designtapeouttape & reelwafer sort testing

Card issuance services We unlock the issuer and cardholder experience with truly unique card issuance and card personalization services. Payment In the current transformation of the payment and banking industry the payment card—whether digital or physical, made of metal or recycled plastic—turns out to be the strongest link to the end customer, for traditional banks as well as for FinTechs. At IDEMIA, we strive to strengthen this link with a wide range of card issuance services and card personalization services. We are the only global player in the market to master the complete payment card design and card issuance process—from the artwork creation to card personalization and delivery to the cardholder’s doorstep. With over 30+ service centers and more than 800 million payment cards personalized per year in 180+ countries, we deliver added-value card issuance services for issuers with.

biometricscard issuancecard personalizationcryptographydata analytics and AIenrollment and verificationidentity verification

Imec is the world's leading independent nanoelectronics R&D hub, founded in 1984 and headquartered in Leuven, Belgium. It combines talent, infrastructure, and a partner network to enable breakthroughs toward microchips that are smaller, faster, more affordable, and more sustainable, and combines nanotech expertise with data and AI. Imec operates globally with offices across Belgium, Europe, the USA, the UK, and Asia, and has a team of 6,500 scientists, engineers, and innovators from over 100 countries.

advanced packagingAI and accelerated computingcleanroom researchlithographynanoelectronics R&Dsemiconductor manufacturing

InspireSemi provides high-performance, energy-efficient accelerated computing solutions for High-Performance Computing (HPC), AI, graph analytics, and other compute-intensive workloads. Its Thunderbird 'supercomputer-cluster-on-a-chip' is a next-generation datacenter accelerator based on the open standard RISC-V instruction set architecture, targeting industries including financial services, computer-aided engineering, energy, climate modeling, and life sciences & drug discovery.

accelerated computing platform developmenthardware, software, power, and cooling systems

Kepler Computing Inc. develops AI memory and logic technologies, describing its memory as leadership memory beyond HBM & SRAM, designed to approach the bandwidth per watt of SRAM while going beyond the capacities of SRAM and HBM for high-throughput, high-interactivity inference. The company has its own dedicated 300mm fab and plans to scale up in America, with sampling by year end, ramping in 2027, and 2028-30 allocations. It has raised $468M.

300mm fab manufacturing3D logic stackingadvanced packagingarchitecturecircuitsmemory and logic manufacturing